Salaries / Materials Engineers
Materials Engineers H-1B salaries
Auto-summary H-1B filings: DOL disclosure data SOC 17-2131
Employers filed 1,593 certified H-1B applications for materials engineers (July 2025 to June 2026), from 402 employers.
Nationally, the middle half of offers were $105,500 to $139,500, with a median of $125,000.
Of the 4 metro areas with at least 100 filings, the highest median offer was in San Jose-Sunnyvale-Santa Clara, CA ($156,000) and the lowest in Phoenix-Mesa-Chandler, AZ ($122,500).
By city
Metro areas with at least 25 filings. Areas with 100 or more have their own page.
| Metro area | Filings | 25th pct | Median | 75th pct |
|---|---|---|---|---|
| Portland-Vancouver-Hillsboro, OR-WA | 390 | $112,500 | $133,500 | $133,500 |
| Phoenix-Mesa-Chandler, AZ | 191 | $105,500 | $122,500 | $128,000 |
| San Jose-Sunnyvale-Santa Clara, CA | 181 | $148,500 | $156,000 | $179,000 |
| San Francisco-Oakland-Fremont, CA | 123 | $137,000 | $138,500 | $155,500 |
| Boise City, ID | 78 | $115,000 | $124,000 | $137,500 |
| Albuquerque, NM | 51 | $95,500 | $95,500 | $95,500 |
| Austin-Round Rock-San Marcos, TX | 37 | $100,500 | $124,000 | $135,500 |
| Boston-Cambridge-Newton, MA-NH | 28 | $105,000 | $128,000 | $143,000 |
| Chicago-Naperville-Elgin, IL-IN | 28 | $84,000 | $104,500 | $132,000 |
Wage levels
| Level | Share of filings (US) |
|---|---|
| Level I (entry) | 12% |
| Level II (qualified) | 28% |
| Level III (experienced) | 42% |
| Level IV (fully competent) | 18% |
Top sponsors nationally
| Employer | H-1B filings | Median offer | Green card filings (PERM) |
|---|---|---|---|
| Intel Corporation | 480 | $133,500 | 315 |
| Lam Research Corporation | 108 | $138,500 | 26 |
| Applied Materials, Inc | 76 | $153,000 | 44 |
| Micron Technology, Inc. | 58 | $126,500 | 5 |
| TSMC Arizona Corporation | 48 | $109,500 | 27 |
| Apple Inc. | 43 | $155,500 | 5 |
| Asm America Inc. | 38 | $122,500 | 20 |
| Western Digital Technologies, Inc. | 28 | $153,500 | 6 |
| Samsung Austin Semiconductor, LLC | 19 | $115,000 | 11 |
| KLA Corporation | 19 | $146,000 | 15 |
| Headway Technologies, Inc. | 16 | $164,000 | 3 |
| Micron Idaho Semiconductor Manufacturing (Triton) LLC | 14 | $109,000 | — |
| Tesla, Inc. | 13 | $146,000 | 3 |
| GlobalFoundries U.S., Inc. | 10 | $118,500 | 7 |
| Sandisk Technologies, Inc. | 8 | $167,500 | — |
| Taurus Industrial Group, LLC. | 8 | $105,000 | — |
| Corning Research & Development Corporation | 8 | $110,500 | — |
| Battelle Energy Alliance, Llc | 7 | $138,000 | — |
| Rensselaer Polytechnic Institute | 7 | $62,000 | — |
| 3M Company | 7 | $128,000 | — |
Common titles filed under this occupation: Process Engineer, Materials Engineer, Product Engineer, Packaging Engineer, Process Support Engineer, Staff Engineer, Hardware Development Engineering, Senior Engineer I, Process Engineering, Field Process Engineer, Semiconductor Process Engineer, Research Scientist.
Offers from certified Labor Condition Applications (Certified H-1B LCAs decided July 2025 to June 2026); base pay only, annualized. Source: DOL disclosure data. Not legal or financial advice.